MIJING MS1 Motherboard Preheating Station PCB Heating Platform for Phone Chip Removal Desoldering BGA Repair Tool

MIJING MS1 Motherboard Preheating Station PCB Heating Platform for Phone Chip Removal Desoldering BGA Repair Tool

MIJING MS1 intelligent desoldering preheating platform adopts newly upgraded hollow-out heating modules specially.It only delivers precise localized heating to the mainboard middle layer, effectively avoiding high-temperature damage to peripheral small components and preventing chip tin popping during heating. Equipped with replaceable positioning templates covering Phone 11 -17PM

🔥 Hollow local middle-layer heating, no overheat damage to surrounding parts

🛡️ Special hollow design effectively stops chip tin popping

📱 Full template coverage for iP 11–17 Pro Max models

⚙️ Digital adjustable temperature & timing for controlled heating

🛠️ Ideal for motherboard layering, splitting and reattachment repair